Electronic circuit package

ABSTRACT

An electronic circuit package having a wiring substrate, at least two semiconductor chips and a bus line. All the semiconductor chips to be connected by means of the bus line are bare chip packaged on a wiring substrate, and the semiconductor chips and the wiring substrate are connected by wiring bonding between wire bonding pads formed on the semiconductor chips and the wiring substrate. The wiring substrate may be a multilayered substrate. Preferably, there is an insulating layer partially formed on the surface of the multilayer wiring substrate and a die bonding ground formed on the surface of the insulating layer, in order to use a portion of the multilayer wiring substrate under the die bonding ground as a wiring or a via hole region, and at least one of the semiconductor chips is formed on the die bonding ground. The bus line preferably includes two data bus lines, the semiconductor chips connected with one data bus line are formed on one side of the wiring substrate and the semiconductor chips connected with the other data bus line are formed on the other side of the wiring substrate.

CROSS REFERENCE TO RELATED APPLICATIONS

[0001] This application is a continuation of Ser. No. 09/095,049, filedJun. 10, 1998, which is a continuation of Ser. No. 08/746,942, filedNov. 18, 1996, which is a continuation of Ser. No. 08/523,346, filedSep. 5, 1995, now U.S. Pat. No. 5,614,761, which is a continuation ofSer. No. 07/843,234, filed Feb. 28, 1992, now U.S. Pat. No. 5,468,992.

BACKGROUND OF THE INVENTION

[0002] The present invention relates to miniaturization of an electroniccircuit package and more particularly to an extra-small computer for usein space exploration.

[0003] A number of computers are being employed for various uses and thedemand for smaller and lighter computers has also increased. Computersfor use in space are required to be particularly smaller and lighterthan conventional computers in order to decrease launching costs whileincreasing the payload.

[0004] As shown by a photograph 1 of “Development of LSI for RadiationResistant 16-Bit Microprocessor”, pp. 10-411, Goke et al. Collection ofPapers at 32nd Space Science and Technology Federation Lecture Meeting,a space computer is built of, for instance, discrete parts withreliable, resistant-to-environment single chips contained in onepackage.

[0005] There is no serious consideration given to decreasing the sizeand weight in the computer as comprised by the discrete parts.

[0006] On the other hand, a so-called multiple chip mounting technique,that is, the technique of mounting a plurality of bare chips on onewiring substrate for use on the ground is being studied. It hasheretofore been arranged that, as shown in FIG. 3 of “Nikkei MicroDevice”, pp. 32-40, December Issue, 1989, a wiring conductor to beconnected to a bonding pad is led out of the bonding page.

[0007] It was not considered, however, to make wiring density uniform inthis technique. The wiring density around the die bonding pad inparticular is made extremely high and consequently effective wiringcannot be implemented. The wiring density in the outermost layer thuscauses a bottleneck and the package size is not sufficiently reduced. Asthe via hole connecting the upper and lower layers occupied most of thearea on the particular multilayer wiring substrate, the via holesaccount for a large percentage of area on the outermost layer,particularly around the die bonding pad.

[0008] With respect to a fault tolerant system, a checking unit fordetecting errors and faults and a unit under check are accommodated inone and the same chip to reduce the size as described in “TrialManufacture and Evaluation of Fault Tolerant Quartz Oscillation IC”, byTsuchimura et al., Research Material, 24th FTC Study Meeting. With thediffusion of ASICs (Application Specified ICs) is particular, attemptshave been made to add an MPU inspection circuit by making an ordinaryMPU a core through the ASIC technology.

[0009] Faults and trouble affecting the whole chip were not taken intoconsideration in this technique described above. When the checking unitand the unit under check develop trouble simultaneously, theirregularity might not be detected.

SUMMARY OF THE INVENTION

[0010] An object of the present invention is to provide a small andlight electronic apparatus, in particular an electronic circuit package,with high reliability.

[0011] Another object of the present invention is to provide a small andlight electronic apparatus in which the number of pins affixed to theoutside of the package is reduced to prevent an increase of the packagesize.

[0012] Further still, yet another object of the present invention is toprovide a small and light electronic apparatus in which theconcentration of the wiring density is eased to prevent the increase ofthe package size.

[0013] According to the present invention, all semiconductor chips to besubstantially connected by means of a bus line are bare chip packaged ona wiring substrate, and the semiconductor chips and the wiring substrateare connected by wiring bonding between wire bonding pads formed on thesemiconductor chips and the wiring substrate. The wiring substrate maybe a multilayered substrate.

[0014] Preferably, there is an insulating layer partially formed on thesurface of the multilayer wiring substrate and a die bonding groundformed on the surface of the insulating layer, in order to use a portionof the multilayer wiring substrate under the die bonding ground as awiring or a via hole region, and at least one of the semiconductor chipsis formed on the die bonding ground. In a preferred embodiment of thepresent invention, there are wiring conductors from the wiring pads andvia holes formed in the periphery and inside of the die bonding ground,and the wiring conductors are connected to other wiring conductors of adifferent wiring layer in the multilayer wiring substrate through thevia hole.

[0015] Preferably, the bus line includes two data bus lines. Thesemiconductor chips connected with one data bus line are formed on oneside of the wiring substrate and the semiconductor chips connected withthe other data bus line are formed on the other side of the wiringsubstrate.

[0016] Preferably, the semiconductor chips include a checking unit and aunit under check.

[0017] Electronic apparatuses such as computers include a plurality ofsemiconductor chips that are normally connected to a bus having a numberof signal lines. With discrete parts constituting the apparatusconventionally, an enormous number of pins are required as the signallines connected to the bus are used to couple the internal and externaldevices of a package. In the present invention, as all of thesemiconductor chips connected to the bus are formed into a singlepackage, the number of signal lines connecting the inside and outside ofthe package is drastically reduced. In other words, the number of pinsconnecting the signal lines inside and outside of the wiring substratedecreases. As a result, the electric apparatus become small and light incomparison to conventional apparatuses.

[0018] Moreover, as each semiconductor chip is subjected to bare chipspackaging, a fault of one chip does not influence other chips.

[0019] As lead-out lines can be formed from wiring bonding pads and viaholes even under the die bonding ground, according to the presentinvention, the wiring density in the neighborhood of the wire bondingpads is prevented from centering there around. Therefore, the wiringdensity in each wiring layer is uniformized to the extent that they areeffectively utilizable. As a result, the package becomes small.

[0020] The data line connected to MPU (Microprocessing Unit) ranges from4, 8, 16, 32 up to 64 bits in width, for instance, depending on the kindof MPU. On the other hand, the data line connected to ROM (Read OnlyMemory) and RAM (Random Access Memory) ranges from 1, 4 up to 8 bits inwidth, for instance, depending on the kind of data line to be connectedto the storage element. In other words, the data width of the storageelement in this case is narrower than that of the MPU in many cases.Therefore, according to a preferred embodiment of the present invention,the data lines are grouped according to the width to be connected to thestorage element and the storage element to be connected to the data linebelonging to the same group is packaged on the same surface of thewiring substrate. As a result, the number of wiring layer-to-layerconnections (via holes) is reduced and the wiring substrate is minimizedin size as the area occupied by the via hole is decreased.

[0021] Although the semiconductor element often causes transistor(gate)-based trouble in many cases, the trouble may involve the wholeelement (chip). In the case of the trouble involving the whole chip, theelectronic apparatus comprising the checking unit and the unit undercheck is unable to detect the trouble, thus making the addition of thechecking unit meaningless.

[0022] Even when the checking unit and the unit under check areconstructed of different packages, it will be essential for the checkingsignal lines to be provided between the checking signal lines. This willincrease the size of the electronic apparatus.

[0023] Consequently, the checking unit and the unit under check areseparately provided in respective chips on the same wiring substrate ona bare chip basis. The wiring substrate and the bare chips are connectedby wire bonding into a single package. The omission of a fault involvingthe whole chip is thus prevented and furthermore, a small, light-weightelectronic apparatus can be made available.

BRIEF DESCRIPTION OF THE DRAWINGS

[0024] These and other objects, features and advantages of the presentinvention will be understood more clearly from the following detaileddescription with reference to the accompanying drawings, wherein

[0025]FIG. 1 is an overall structural view of an embodiment of thepresent invention;

[0026]FIG. 2 is a sectional view of the die bonding portion of a wiringsubstrate according to the present invention;

[0027]FIG. 3 is a diagram showing an arrangement of via holes in anembodiment of the present invention;

[0028]FIG. 4 is a diagram showing a division of a data bus in anembodiment of the present invention;

[0029]FIG. 5 is a diagram showing a division of a data bus having 32bits width in an embodiment of the present invention;

[0030]FIG. 6 is a structural view of an MPU with checking circuit and anRAM with an error correction code on a wiring substrate in an embodimentof the present invention;

[0031]FIG. 7 is a structural view of an MPU with an external ROM on awiring substrate in an embodiment of the present invention;

[0032]FIG. 8 is a circuit diagram of an electronic apparatus accordingto the present invention;

[0033]FIG. 9 is a diagram showing packaging of semiconductor chips asshown in FIG. 8 on one side of a wiring substrate;

[0034]FIG. 10 is a diagram showing packaging of semiconductor chips asshown in FIG.8 on the other side of the wiring substrate; and

[0035]FIG. 11 is a sectional view of a package in an embodiment of thepresent invention.

DESCRIPTION OF THE PREFERRED EMBODIMENT

[0036]FIG. 1 illustrates the inner construction of an electronicapparatus embodying the present invention by way of example. In theembodiment shown, MPU 101, RAM 102, ROM 103, FPU (Floating-pointProcessing Unit) 104, DMAC (Direct Memory Access Controller) 105, andinterface circuit 106 are connected via bus 100 in a wiring substrate10. What is particularly noticeable according to this embodiment is thatthe bus 100 does not lead out of the wiring substrate 10, but only aninterface line 107 which interfaces with external devices leads out ofthe wiring substrate 10.

[0037] All semiconductor chips to be connected to the bus 100 aretotally packaged on the wiring substrate 10 according to thisembodiment. Since the bus 100 does not led out of the wiring substrate10, the number of signal lines connecting between internal and externaldevices is reduced by a large margin over the prior art. Accordingly,the number of pins connecting between the signal lines inside andoutside the wiring substrate 10 decreases and this overcomes an obstacleto rendering the wiring substrate smaller and lighter.

[0038]FIG. 2 is a sectional view of a die bonding portion of the wiringsubstrate according to the present invention. Wire bonding pads 11 areformed on the wiring substrate 10 and an insulating layer 16 is formedon a wiring conductor 14 for use in leading out of the wire bonding pad.A die bonding ground 15 is formed on the insulating layer 16 and asemiconductor chip 20 is bonded thereto by die bonding. A bonding wire30 is then used for connecting a wire bonding pad 21 on thesemiconductor chip 20 and the wire bonding pad 11 on the wiringsubstrate 10. According to this embodiment, as shown in FIG. 3, viaholes 13, 13′ may be formed in the periphery and inside of the diebonding ground 15, respectively. Via hole 13 formed in the periphery ofsaid die bonding ground 15 and said wire hole 13′ formed inside of saiddie bonding ground 15 are preferably arranged alternately. As a result,a portion beneath the die bonding ground 15 as the outermost layer thathas heretofore not been utilized may be put to practical use as a wiringand a via hole region. An area to be occupied by wiring and via holeregions can thus be made drastically smaller than what is occupied bythe semiconductor chip of the wiring substrate.

[0039]FIG. 4 refers to an embodiment wherein signal lines of the databus 100 connected to MPU 101 are divided into two groups 100-1 and100-2.

[0040] RAMs 102-1-102-k and ROMs 103-1-103-k connected to the data bus100-1 are packaged on one side (B side) of the substrate, whereas RAMS102-(k+1)-102-N, ROMs 103-(k+1)-103-N connected to the data bus 100-2are packaged on the other side (A side) of the substrate, wherein k andN are integers. According to this embodiment, it is unnecessary toconnect the data bus on the A side to what is on the B side and hencethe number of via holes in a wide area is significantly reduced. As aresult, an area to be occupied by wiring and via hole regions can thusbe made drastically smaller than what is occupied by the semiconductorchip of the wiring substrate, so that the electronic apparatus can bemade smaller and lighter.

[0041]FIG. 5 refers to an embodiment, wherein the data bus 100 connectedto the MPU 101 is 32 bits wide and the data bus connected to ROM and RAMis 8 bits wide. Among data lines DO-D31 constituting the data bus 100,DO-D15 are formed into a group of data bus 100-1, and D16-D31 into agroup of data bus 100-2. DO-D7 in the group of data bus 100-1 areconnected to RAM 102-1 and ROM 103-1, and D8-D15 to RAM 102-2 and ROM103-2. Moreover, D15-D23 in the group of data bus 100-2 are connected toRAM 102-3 and ROM 103-3, and D24-D31 to RAM 102-4 and ROM 103-4.According to this embodiment, the electronic apparatus can be madesmaller and lighter as in the case of the embodiment shown in FIG. 4.

[0042] According to the embodiments shown in FIGS. 2 to 5, it is alsopossible to package as many bare chips as possible on the wiringsubstrate limited in size.

[0043]FIG. 6 refers to an embodiment wherein MPU 101, a checking circuit111 of the MPU 101, and RAM 102, an error correction codeencoding/decoding circuit 112 are packaged in the form of bare chips onthe wiring substrate 10. In this case, a bonding wire has been omittedfor simplification.

[0044] MPU 101 and the checking circuit 111 are different bare chips andconnected by wire binding on the wiring substrate 10. Heretofore,various systems have been proposed as the checking circuit 111. Thereare the following, for instance:

[0045] (1) A watch dog timer for resetting MPU 101 after sensing itsoperation on impulse when it is inaccessible within a fixed period oftime.

[0046] (2) A system having a reference MPU (not shown) within thechecking circuit 11 and while comparing the output signal of thereference MPU with that of MPU 101, regards the reference MPU or MPU 101as irregular once nonconformity is found and so on.

[0047] In the conventional method of packaging MPU 101 and the checkingcircuit 111 separately, the number of packages, the number of wires anddimensions of the electronic apparatus tend to increase. In the methodrecently followed for forming the MPU 101 and the checking circuit 111on the same chip, moreover, a fault involving the whole chip is notcompletely detectable as even the checking circuit 111 ceases tofunction.

[0048] According to this embodiment, MPU 101, with the checking circuit111 capable of detecting a fault involving the whole chip, is providedwithout causing the number of packages and that of wire to increase.Therefore, a small lightweight, reliable electronic apparatus can beprovided.

[0049] RAM 102 and the error correction code encoding/decoding circuit112 are different bare chips and connected by wire bonding on the wiringsubstrate 10.

[0050] The error correction code adds an error detection/correctionredundant bit to the data stored in the memory, thus causing an error tobe detected and corrected by making a code-to-code Hamming distance 4 orgreater. When the code-to-code Hamming distance is set to 4, 1-bit errorcorrection is possible, but a 2-bit error remains only detectable.Consequently, it is called SECDED (Single-Error-Correction, Double-ErrorDetection). For instance, a 6-bit detection/correction redundant bitneeds adding when SECDED is meant to be realized concerning 16-bit data.A detailed description of an error correction code will be omitted sincethe present invention is not aimed to provide the error correction code.

[0051] In the conventional method of packaging RAM 102 and the errorcorrection code encoding/decoding circuit 112 separately the number ofpackages and the number of wires and dimensions of the electronicapparatus tend to increase. In the method recently followed for formingthe RAM 102 and the error correction code encoding/decoding circuit 112on the same chip, moreover, a fault involving the whole chip is notcompletely detectable as even the error correction codeencoding/decoding circuit 112 ceases to function.

[0052] According to this embodiment, RAM 102 with error correction codeencoding/decoding circuit 112 capable of detecting a fault involving thewhole chip is provided without causing the number of packages and thatof wires to increase. Therefore, a small lightweight, reliableelectronic apparatus can be provided.

[0053] Like other semiconductor elements, the storage element (ROM)storing the program involved is packaged on the same wiring substrate inthe form of a bare chip and if it is incorporated into the same package,the electronic apparatus may be made drastically smaller and lighter. IfROM is incorporated into the package, it requires programming anderasing methods. Use of EEPROM (Electrically Erasable Programmable ROM)will make programming readily possible and make the program erasable.Even when UVEPROM (Ultra-Violet Erasable Programmable ROM) is used, theprogram may be executed or erased by providing the apparatus with awindow which allows erasing ultra-violet rays which pass therethrough.

[0054] When EPROM is used as a space electronic apparatus to be exposedto cosmic rays, the data written by means of the cosmic ray may beerased. Moreover, EPROM is not fit for use as an electronic apparatus tobe used over several hundred thousand years as the electronic thermalmovement. Therefore, mask- or fuse-ROMs will have to be used for thepurpose described above.

[0055] For program development, the program involved has to be modifiedand rewritten. For this reason, a mask- or fuse-ROM may not efficientlybe used for such program development.

[0056] According to the following embodiment of the present invention,the electronic apparatus leads the line connected to ROM out of thepackage and makes it possible to operate ROM outside the package.Consequently, no wire bonding is provided for ROM in the developingpackage. By connecting a program externally, that is, its easilyerasable EPROM to an external device, any program may be developed bymeans of a wiring substrate having the same pattern as that proposed inthe present invention.

[0057]FIG. 7 refers to an embodiment wherein either ROM inside thewiring substrate 10 or an external ROM may be used to operate MPU. RAM102 and ROM 103 are connected to MPU 101 via the bus 100 in the wiringsubstrate 10. Moreover, RAM 102 and ROM 103 selection signals CS# areformed by an address decoder 107. Although a signal name with a linethereon is provided for each active low signal in FIG. 7, the signalname followed by a ‘#’ mark is employed in this specification forconvenience of description. The address decoder 107 decodes highersignificant bits in an address signal supplied to the bus 100 and whenthe address signal indicates the address of RAM 102 or ROM 103, appliesthe corresponding selection signal CS# to RAM 102 or ROM 103. While theselection signal CS# is active, RAM 102 or ROM 103 reads or writesdesired address data in accordance with lower significant bits.

[0058] According to this embodiment, ROM 103 selection signal CS# 108 isalso sent out of the wiring substrate 10. Consequently, ROM 103′ outsidethe wiring substrate 10 in place of ROM 103 inside the wiring substrate10 may be used for operation. Moreover, as part of the lower significantbits in the address bus signal is sufficient for an address line to beconnected to ROM 103′, the number of leader lines from the wiringsubstrate 10 is also prevented from increasing. In order to develop aprogram, it is only necessary to write the program to ROM 103′ outsidethe wiring substrate 10 without packaging ROM 103 inside the wiringsubstrate 10. Hence, efficient program development can be made as aprogram is readily written to and erased from ROM. If a mask- and afuse-ROM are used as ROM 103 inside the wiring substrate 10 for anactual apparatus after program development, fear of risking erasure ofdata in ROM 103 is eliminated and an electronic apparatus stands toremain in good condition after long use.

[0059]FIG. 8 is a circuit diagram embodying the present invention. MPU101, RAM 102, ROM 103, FPU 104, DMAC 105, and a gate array 110 in theform of bare chips are mounted on the wiring substrate 10. Although RAM102 and ROM 103 consist of a plurality of chips, depending on the memorycapacity and bit width, each of them is indicated as one in FIG. 8 forsimplification. The gate array 110 includes the checking circuit 111formed with a watch dog timer and the like for detecting the operationof MPU on impulse, the error correction code encoding/decoding circuit112 for correcting the inversion of data in RAM 102, the address decoder107, the interface circuit 106 with external devices and the like asbuilt-in elements. (These circuits in the gate array are not shown inFIG. 8). The number of chips can thus be reduced significantly as theperipheral circuits of MPU 101 are made into such a gate array form.

[0060] As the checking circuit 111 and the error correction codeencoding/decoding circuit 112 are accommodated on the chips differentfrom those for MPU 101, RAM 102 with respect to gate array 110, theomission of detection of a fault involving the whole chip is prevented.

[0061] Although use can be made of various kinds of respective MPU 101,FPU 104, DMAC 105, an illustration of FIG. 8 is based on the assumptionthat a GMICRO/200 (H32/200) series is employed. Consequently, names ofvarious control signal lines are indicated in accordance with thespecification of the GMICRO/200 (H32/200) series. Since the presentinvention is not implemented specifically by a particular productseries, the description of signal names irrelevant to the presentinvention particularly will be omitted; the detailed description of themhas been given in a document (‘H32/200 Hardware Manual’, Hitachi Ltd.).Incidentally, the bit positions of address and data lines are providedin the form of bigendian display and lower significant bits aretherefore expressed by small numbers. For instance, AO of the addressline represents the highest signification bit, whereas A29 representsthe lowes significant bit.

[0062] The bus signal lines led out of the wire substrate 10 accordingto this embodiment are only as follows: address lines A13-A29, datalines DO-D31, address strobes AS1#, AS2#, byte control signalsBCO#-BC2#, a read/write switching signal R/W#, and a data transfertermination signal DC#. In other words, as only of the bus signal linesis led out of the wiring substrate 10, the number of pins affixed to theoutside of the package is reducible, whereby the package size can bemade smaller. If it is arranged not to use ROMs outside the wiringsubstrate 10, all of these bus signal lines will not necessarily be ledout. Thus, the number of pins is significantly reduced.

[0063] The address decoder 107 (not shown) in the gate array generatesthe ROM selection signal ROCS#108, a RAM selection signal RACEO#-RACE3#,an external element selection signal XCS# by means of the address linesAO-A12.

[0064] The ROM selection signal ROCS#108 on one of these signal lines isconnected to ROM 103 in the wiring substrate 10 and simultaneously ledout of the wiring substrate 10. According to this embodiment, ROM 103′(not shown) in place of ROM 103 inside the wiring substrate 10 may beconnected to the outside of the wiring substrate 10 and used foroperation. Moreover, as part of the lower signification bits A13-A29 inthe address bus signal sufficient for an address line to be connected toROM 103′, the number of leader lines from the wiring substrate 10 isalso prevented from increasing. In order to develop a program, it isonly needed to write the program to ROM 103′ outside the wiringsubstrate 10 without packaging ROM 103 inside the wiring substrate 10,Hence, efficient program development can be made as a program beingreadily written to and erased from ROM. If a mask- and a fuse-ROM isused as ROM 103 inside the wiring substrate 10 for an actual apparatusafter the program development, fear of risking erasure of data in ROM103 is eliminated and an electronic apparatus stands to remain in goodcondition after long use.

[0065] RACEO#-RACE1# out of the RAM selection signals RACEO#- RACE3# areconnected to RAM 102 inside the wiring substrate 10, whereasRACE2#-RACE3# are led out of the wiring substrate 10. If RACE2#-RACE3#lead out of the wiring substrate 10, the byte control signal BCO#-BC2#,the read/write switching signal R/W#, the address lines A13-A29 and thedata lines DO-D31 are connected to RAM 102′ (not shown) outside thewiring substrate 10, an increase in storage capacity may be attainedwith the combination of RAM 102 and RAM 102′.

[0066] The external element selection signal XCS# leads out of thewiring substrate 10 and if the external element selection signal XCS#,the byte control signal BCO#-BC2#, the read/write switching signal R/W#,address strobes AS1#, AS2#, the data transfer termination signal DC#,the address lines A13-A29 and the data lines DO-D31 are connected to anexternal element (not shown), system expendability will be improved asthe external element becomes usable.

[0067] The number of pins may drastically be reduced when the externalelement is not connected as the RAM selection signals RACE2#-RACE3#, theselection signal XCS#, the byte control signal BCO#-BC2#, the read/writeswitching signal R/W#, the address strobes AS1#, AS2#, the data transfertermination signal DC#, the address lines A13-A29 and the data linesDO-D31 are unnecessary to lead out of the wiring substrate 10 to RAM102′ outside the wiring substrate 10.

[0068] In addition, the gate array 110 may be allowed to incorporate theinterface circuit 106 with external devices. A signal line MIL-1553B isemployed for use in the so-called MIL -1553B communication standard.Moreover, a communication line CELLCOMCNTR is a communication line forcoupling a plurality of computer units, each having the wiring substrate10. If the number of wiring substrates 10 required is prepared for thecommunication lines CELLCOMCNTR to be connected together, it willfacilitate the construction of a multiprocessor system or a multiplexcomputer system for fault tolerance.

[0069]FIGS. 9 and 10 illustrate methods of packaging the wiringsubstrate 10 embodying the present invention as shown in FIG. 8.

[0070] MPU 101, FPU 104, ROMs 103-1, 103-2 and RAM 102-1, 102-2 aremounted on the surface (B side) shown in FIG. 9. The storage element,ROMs 103-1, 103-2 and RAMs 102-1, 102-2 connected to the data lineswhich belong to the bus 100-1 are mounted on this surface as shown inFIG. 5.

[0071] DMAC 105, the gate array 110, ROMs 103-3, 103-4 and RAMs 102-3,102-4 are mounted on the surface (A side) shown in FIG. 10. The storageelement, ROMs 103-3, 103-4 and RAMs 102-3, 102-3 connected to the datalines which belong to the bus 100-1 are mounted on this surface as shownin FIG. 5.

[0072] As the number of wiring layer-to-layer via holes as reducedaccording to this embodiment, the wiring substrate 10 can be madesmaller. Moreover, the concentration of heat and wiring to one side ismade avoidable by splitting LSI, MPU 101, FPU 104, DMAC 105 and the gatearray 110 into two groups, each having a large chip size and manyinput-output signal lines, and allotting them to the respective sides.In view of thermal resistance, chemical stability and the like, aceramic substrate is fit for use as the wiring substrate 10 when it isemployed in space where reliability is required.

[0073]FIG. 11 illustrates a package embodying the present invention.Ceramic caps 50 are attached to the respective sides of the ceramicwiring substrate 10 to hermetically seal bare chips such as MPU 101mounted thereon. The inside thus hermetically sealed by the caps 50 iskept under vacuum or filled with an inactive gas of nitrogen, helium orthe like. If the helium is filled up, it will conveniently be used forleakage checking when the airtightness of the seal is checked. When itis attempted to accommodate a plurality of chips into a single package,the package tends to become large and the volume of the air inside thecaps 50 also tends to increase. When the ceramic caps 50 are attached tothe respective sides of the ceramic wiring substrate 10 before beingused to hermetically seal the contents by soldering, the molten soldermay be drawn into or jutted out of the caps 50 due to the difference ispressure between the inside and the outside as the solder cools. One ofthe measures to be taken to prevent the molten solder from being drawninto or jutted out of the caps 50 even though a package is large is tobore ventilating holes 51 into them and to over the holes 51 with lids52 or the like after the contents are hermetically sealed with theinactive gas encapsulated.

[0074] According to the present invention, a plurality of semiconductorelements can be accommodated in a single package and the number ofsignal lines to be led out of the package is reducible, so that thepackage size in decreased. Therefore, a small lightweight electronicapparatus is made available.

[0075] Many different embodiments of the present invention may beconstructed without departing from the spirit and scope of theinvention. It should be understood that the present invention is notlimited to the specific embodiments described in this specification. Tothe contrary, the present invention is intended to cover variousmodifications and equivalent arrangements included within the spirit andscope of the claims.

1. A method of data transmission of a data processing apparatus whichcomprises a microprocessor having data width of m bits (wherein m is aninteger), a plurality of memory chips connected to said microprocessor,each of said memory chips having data width of n bits (wherein n is aninteger, and m is integer times n), and said plurality of memory chipsis divided into two groups, and memory chips of each said groups aremounted on different substrate surfaces, said method comprising thesteps of: said microprocessor outputting an address signal to saidplurality of memory chips; each of said memory chip outputting n bitdata to said microprocessor simultaneously based on said address signal.2. A method of data transmission of a data processing apparatusaccording to claim 1, wherein said memory chips include random accessmemory chips.
 3. A method of data transmission of a data processingapparatus according to claim 1, wherein said memory chips of said onegroup are assigned to upper bits of said m bits, and said memory chipsof said other group are assigned to lower bits of said m bits.
 4. Amethod of data transmission of a data processing apparatus whichcomprises a microprocessor having data width of m bits (wherein m is aninteger), a plurality of memory chips connected to said microprocessor,each of said memory chips having data width of n bits (wherein n is aninteger, and m is an integer times n), and said plurality of memorychips is divided into two groups, and memory chips of each said groupare mounted on different substrate surfaces, said method comprising thesteps of: said microprocessor outputting an address signal for demandingm bit data to each memory chip; each of said memory chip outputting nbit data to said microprocessor simultaneously based on said addresssignal.
 5. A method of data transmission of a data processing apparatusaccording to claim 4, wherein said memory chips include random accessmemory chips.
 6. A method of data transmission of a data processingapparatus according to claim 4, wherein said memory chips of said onegroup are assigned to upper bits of said m bits, and said memory chipsof said other group are assigned to lower bits of said m bits.
 7. A dataprocessing apparatus, comprising: a microprocessor for processing dataand outputting m bits of data (wherein m is an integer) simultaneously;a semiconductor chip module including a substrate and a plurality ofmemory chips having data width of n bits data (wherein n is integer, andm is integer times of n) formed on each side of said substrate; datalines connected to said microprocessor and said plurality of memorychips for slicing m bit data into n bit data and providing said sliced nbit data to each memory chip.
 8. A data processing apparatus accordingto claim 7, wherein said memory chips include random access memorychips.
 9. A data processing apparatus according to claim 7, wherein saidmemory chips mounted on one side of said substrate are assigned to upperbits of said m bits, and said memory chips mounted on other surface ofsaid substrate are assigned to lower bit of said m bits.
 10. A dataprocessing apparatus according to claim 7, wherein said m bit data isstored in said memory chips based on a same address signal.
 11. A dataprocessing apparatus according to claim 7, wherein said memory chips areoutput to said data lines based on a same address signal.
 12. A methodof data transmission of data processing apparatus which comprises amicroprocessor for processing data, a semiconductor chip moduleincluding a substrate and a plurality of memory chips having data widthof n bit data (wherein n is an integer, and m is an integer times n)formed on each side of said substrate, data lines connected to saidmicroprocessor and said plurality of memory chips for slicing m bit datainto n bit data and providing said sliced n bit data to each memorychip, said method comprising the steps of: said microprocessoroutputting an address signal and m bit data (wherein m is integer)simultaneously, each of memory chip stores n bit data based on saidaddress signal.
 13. A method of data transmission of a data processingapparatus according to claim 12, wherein said memory chips includerandom access memory chips.
 14. A method of data transmission of dataprocessing apparatus according to claim 12, wherein said memory chipsmounted on one side of said substrate are assigned to upper bit of saidm bits, and said memory chips mounted on other surface of said substrateare assigned to lower bits of said m bits.